- Ceria, alumina, silicon oxide, iron oxide,
zirconia, and other components are frequently found in polishing powder.
There is also a lot of common polishing powder, including rare earth
polishing powder. Due to the hardness and chemical makeup of different
materials in water, application conditions vary. Ceria and silicate glass
are widely used in glass polishing due to their equal hardness and high
chemical activity.
- Cerium oxide particle size: Since tougher
materials may be ground more strongly with higher cerium oxide particle
sizes, ZF glass should require finer polishing powder. It should be noted
that the ceria particle distribution is troublesome.
- While the average particle size, or median
diameter, D50 only impacts the polishing speed, the maximum particle size
Dmax controls the polishing accuracy. Therefore, it is necessary to limit
the maximum particle size of polishing powder in order to obtain high
precision.
- Concentration of the polishing slurry: The
concentration of the slurry controls how quickly the process polishes.
With more focus, polishing proceeds more quickly. The slurry concentration
must be properly managed when using rare
earth polishing powder with fine particles.
- When selecting a polishing die for cerium
polishing powder, it should be softer. A lot of polyurethane polishing
wafers include ceria powder, it should be mentioned. The maximum particle
size of these powders also determines how accurate the final polishing
will be.
- It is the action that needs to be made in order to completely undo any harm done in the past. The most crucial step in preparing a specimen for microstructural examination is polishing. To lessen the need for polishing, it would be ideal to reduce the amount of damage brought on by cutting and grinding using the right blade and abrasive.